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The role involves verifying new silicon products for Ethernet systems, focusing on high throughput and power efficiency. Engineers will utilize constrained random verification methodologies, collaborate with design teams, and lead verification processes, leveraging tools like System Verilog and UVM.

The Senior Hardware System Design Engineer will lead the development of complex PCB system designs and oversee implementation of high-speed channels and power systems. Responsibilities include collaborating with cross-functional teams, providing technical support to ODMs and OEMs, and ensuring robust performance in challenges. The role requires expertise in PCB design tools and strong understanding of system integrations.

The Physical Design Engineer will develop next-generation ASIC products focusing on power grids, 2.5D and 3D die interconnects. Responsibilities include design implementation, electrical checking, automation processes, and collaborating with engineers on high-speed interconnects and technology roadmapping.

The ASIC RTL Design Engineer is responsible for designing and developing digital circuits, defining architecture, and enhancing micro-architecture. This role requires extensive experience in RTL development, SOC architecture, and proficiency in various scripting languages.

The PCIe/CXL Product Applications Engineer will provide technical leadership to Broadcom customers, resolve technical challenges in deploying PCIe products, and leverage knowledge of PCIe design from electrical compliance to protocol functionality. The role involves on-site and remote engagement with customers, requiring exceptional debug skills and extensive lab experience with test equipment such as BERTs and oscilloscopes.

The Sr Consultant and SME of Endevor DEV/Ops will analyze Life Cycle Management data, evaluate solution designs, conduct hardware/software comparisons, and provide post-implementation support. The role involves implementing and upgrading Endevor, enhancing automation capabilities through REXX coding, and traveling to client sites for consulting on technical matters.

The R&D Integration Engineer will develop MEMS micro fabrication technologies, focusing on FBAR piezoelectric process technologies for wireless filters. Responsibilities include hands-on evaluation of wafers, leading technology development, creating MEMS process flows, and collaborating with cross-functional teams.