Account Manager I

Position Description: 

Senior Account Manager for Entegris Inc., Hillsboro, OR.  

Responsible for Advanced Material Handling (AMH) sales to Advanced Logic and Memory accounts to achieve Business Unit (BU) goals. Heavy focus on emerging and industry enabling technologies such as Advanced Packaging, EUV Lithography, Microenvironmental control and monitoring supporting industry progression from Planar to finFET to Gate-All-Around architecture (Logic) and high-density 3D(Memory). Serve as Entegris primary point of escalation in addressing and resolving matters that have been elevated as critical; track and win new opportunities in sustaining applications as well as capital investment events such as fab expansions and new fab construction projects. Develop and own the sales plan that achieves revenue, profitability, and forecasting objectives: Utilize significant technical knowledge of product lines to maintain and pursue new business opportunities; leverage deep customer intimacy and organizational knowledge to effectively position Entegris solutions within customer specification and adoption timelines. Apply technical, engineering, operational acumen, and semiconductor manufacturing knowledge gained through prior in-fab work experience to ensure customer road map and Entegris resources are appropriately aligned driving sustainable and scalable new product development activities. Evaluate ongoing changes in the business that could affect the company’s ability to commit to sales and quality goals. Drive effective pricing strategy through contract and price negotiation processes. Focus on enlarging and developing market share in accordance with total margin strategy: maintain customer profile (market share, Served Available Market). Responsible for accurate forecast, maximizing revenue, margin, market share analysis and achieving Annual Operating Plan: Document Served Available Market Share projections; draft and coordinate the internal communications to confirm forecast feasibility throughout the year along with meeting the customer’s requirements with delivered products. Effective utilization of CRM and sales process methodologies to coordinate all necessary cross-function, cross-regional stakeholders within Entegris and Customer organizations, delivering successful outcomes over extended and complex sales cycles. Coordinate cross functional activities with Applications Engineering, Product Management, Logistics, Quality, Finance, Customer Service, Channel Partners to ensure pre and post sales service levels are commensurate with customer requirements; leverage technical product knowledge and customer ecosystem knowledge to evaluate and mitigate business risks associated with change management, supply chain disruptions, operational constraints, intellectual property protection, and other commercial and/or technical factors.  Develop and maintain senior-level industry contacts and relationships to provide opportunities for new business. Understand customer’s business and technology road map and drive internal teams for continuous improvement in terms of product quality, establishing technical edge, and market competitiveness, maintaining preferred or exclusive supplier position. Travel both domestic and international up to 20%. Hybrid/telecommuting allowed within commuting distance of Portland, Oregon.  

Requirements: 

Master’s degree in Business Administration or Engineering field and 3 years’ experience as a Sales Engineer in the semi-conductor or related industry or Bachelor degree in Business Administration, Engineering, and 6 years’ progressive post bachelor’s years’ exp as a Sales Engineer in the semi-conductor or related industry. 

Must have 2 years’ experience with:  

• In-Fab Operations with intimate understanding of wafer lifecycle processing including incoming bare/EPI Si, FE/ME/BE line processing, and finished wafer processing channels;  

• Defect and yield risks associated with FOUP wash functions and reuse loop;  

• Environmental control and critical process steps that impact device performance and fab yield metrics; and  

• Fab startup to HVM transition process, including wafer integration.  

Must have 3 years’ experience with:  

• End User (Semiconductor/Panel/Storage) market segments, with specific knowledge of Advanced Logic and Memory;  

• In-fab, hands-on manufacturing experience within Intel 300mm manufacturing facility; intimate knowledge of Intel requirements across global Virtual Factory (VF);  

• AOPs and business unit (BU) goal and end-to-end execution of marketing strategies; and  

• SEMI market.