IC Package Development, Signal and Power Integrity Engineer, Staff

Posted 11 Days Ago
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Austin, TX
Senior level
Semiconductor
We create custom semiconductor solutions that move, process, store, and secure data quickly and reliably.
The Role
The role involves advanced microelectronic package development, focusing on signal and power integrity for high-speed IC packages. Responsibilities include electrical design, modeling, and interfacing with suppliers and cross-functional teams to ensure manufacturability and performance requirements.
Summary Generated by Built In

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting up to 224 Gb/s data rates. The engineer will be responsible for package development, electrical design, modeling and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

What You Can Expect

  • Strong fundamentals in EM, transmission lines and microwave theory
  • Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Momentum, COMSOL, CST, PowerSI
  • Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing
  • Familiarity with IC package layout tools like APD or PADS
  • Experience with 2.5D/3D package development is highly desired
  • Ability to automate the SI, PI and Packaging activities using scripting tools like Python
  • Working knowledge of circuit design tools: Spectre, ADS, HSpice
  • Experience with VNA and TDR measurements for packages and PCBs characterization
  • Understanding the frequency domain and time domain knowledge of high speed signaling
  • Experience with high-speed electronic packaging for digital and analog ICs
  • Power plane design, modeling and analysis using tools like PowerSI, SIwave
  • Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
  • Understanding, debugging and simulations of EMI/EMC problems
  • Track record of new product introduction from concept, through development and production is a plus
  • Knowledge of the thermal and mechanical analysis of the IC package development is a plus
  • Experience with channel simulations using MATLAB or ADS or other tools is a plus
  • A team player
  • Strong communication, presentation and documentation skills

What We're Looking For

Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience.
Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
 

Expected Base Pay Range (USD)

106,700 - 157,840, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements 

At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at [email protected].

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Top Skills

Matlab
Python
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The Company
HQ: Santa Clara, CA
6,500 Employees
Hybrid Workplace
Year Founded: 1995

What We Do

Marvell specializes in semiconductor solutions that power a wide range of industries, from data centers and 5G networks to AI, automotive, and storage applications. Our cutting-edge products are designed to meet the constantly evolving demands of a connected world, enabling faster, more efficient and more secure data processing and communication. With a focus on excellence and a commitment to advancing technology, we develop solutions that drive progress and transform industries.

Why Work With Us

Life at Marvell means being a part of new innovation and enduring technology; but it's also much more. Our diverse community is strengthened through cultural events, corporate gatherings and team-building activities, fostering collaboration and making work enjoyable. At Marvell, it's not just a job; it's an enriching, community-driven experience.

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