At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
“Candidate should have demonstratable technical knowledge in all aspects of IC and 3DICDesign from product planning to mass production.
This includes total product design touching multiple domains of chip, package, board, system design and multi-physics analysis with signal, power (SIPI), thermal, structural analysis.
Expertise in 3DIC System Planning (vertical floorplanning), Implementation, bump, TSV and routing optimization. Signoff with Multi-Die/Inter-Die Extraction and related STA, Multi-die DRC/LVS.
Candidate should have hands-on experience in root cause analysis and problem-solving of all the above aspects of 3DIC design.”
The annual salary range for California is $154,000 to $286,000. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.
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What We Do
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and IP are used by customers to deliver products to market faster. The company's Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For.
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