Staff Product Manager, Chiplet Hardware

We are seeking a skilled and driven Chiplet Hardware Product Manager to oversee  the development and product lifecycle of cutting-edge chiplet-based AI and RISC V hardware solutions. This role involves defining product requirements, aligning technical and business strategies, and working cross-functionally to deliver innovative AI hardware products that leverage chiplet technology for optimal performance, scalability, and cost efficiency.

As a key member of the product team, you will collaborate closely with engineering, sales, and manufacturing teams to bring revolutionary AI and RISC V solutions to market.

This role is hybrid, based out of Austin, TX, Santa Clara, CA, Toronto, ON.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Responsibilities:

• Define and drive the product strategy and roadmap for chiplet-based AI hardware.
• Analyze market trends, customer needs, and competitive landscape to inform product decisions.
• Translate customer and market requirements into detailed product specifications.
• Work with engineering teams to define technical specifications for chiplet architecture, packaging, and interconnects.
• Collaborate with engineering teams to ensure design, development, and testing align with product goals.
• Ensure the chiplet design meets performance, power, and cost targets.
• Manage the full product lifecycle, from concept to launch
• Drive decisions on feature trade-offs, timeline adjustments, and resource allocations.
• Deliver presentations, technical briefs, and updates to executives and stakeholders.

Experience & Qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field 
• 5+ years of experience in product management or hardware development in the semiconductor industry, preferably in AI, chiplets, or advanced packaging technologies.
• Hands-on experience with chiplet design, RISC-V, AI accelerators, or other hardware technologies is highly desirable.
• Deep understanding of semiconductor design, packaging, and manufacturing processes.
• Familiarity with interconnect standards such as UCIe, PCIe, and chip-to-chip communication protocols.
• Proven ability to translate complex technical concepts into actionable product strategies.
• Strong skills in market analysis, competitive assessment, and financial modeling.
• Ability to influence and collaborate effectively across diverse teams and levels of the organization.
• Experience working with AI startups or delivering AI accelerator products.
• Knowledge of RISC-V and open hardware ecosystems.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set  by the U.S. government.

Our engineering positions and certain engineering support positions require access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and/or documentation will be required and considered as Tenstorrent moves through the employment process.

If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government.  If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.