Senior Optical Packaging Engineer

We believe quantum computing will change everything.  It will have the power to transform the foundations of giant industries that rely on intensive computation.  PsiQuantum is on a mission to build the world’s first useful quantum computer, capable of delivering these transformative results.  We know that means it will need 1 million qubits, error correction, a scalable architecture and a data center footprint.

By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today’s most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more. 

PsiQuantum is uniquely positioned to deliver on the promise of quantum computing years earlier than our competitors. Our architecture is based on photonics which gives us the ability to produce our components using existing high-volume semiconductor manufacturing processes, the same processes that are today producing billions of chips for telecom and consumer electronics applications. Since photons don’t feel heat, we can take advantage of existing cryogenic cooling systems, the kind that have been operating at facilities like the Stanford Linear Accelerator (SLAC).  And because photons are in fact light, they can move between subsystems at tremendous speed using standard fiber connectivity.

Our team is building a utility scale quantum computer and the software tools needed to build fault tolerant quantum applications. We’re a highly motivated and collaborative group focused on a singular goal - building the world’s first useful quantum computer on the fastest path possible. 

There’s much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey! 

Job Summary:

The Sr. Optical Packaging Engineer is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits. 

Responsibilities:

• Develop an optical package and fiber-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly.
• Help develop packaging prototypes & scalable fiber-to-chip packaging flows, NPI.
• Review packaging design BOMs, work with supply chain on procuring parts needed for assembly.
• Establish and update version-controlled DFM requirements and feed back to packaging design group.
• Work with manufacturing group and vendors on transferring & scaling packaging designs and processes based on successful prototypes.
• Advise manufacturing group and vendors on setup of high-throughput packaging assembly lines.
• Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements. 

Experience/Qualifications:

Mandatory experience/Qualifications:  

• Bachelor’s Degree or above in Engineering, Physics or Material Science.
• 10+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies.
• 5+ years of experience working with optical fibers, optical measurements.
• 5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors.
• 5+ years of experience with semiconductor company or supplier working on FAU / optical connector to chip attachment.
• Experience with fiber attach tooling & process/flow development and optical data analysis.

Nice to have: 

• Experience with FA and 8D failure resolution techniques.
• Experience with developing metrics for yield and quality management, including reliability and yield based on optical and mechanical performance.

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.
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