Senior Electro-Optic Packaging Engineer (Numerical)

We believe quantum computing will change everything.  It will have the power to transform the foundations of giant industries that rely on intensive computation.  PsiQuantum is on a mission to build the world’s first useful quantum computer, capable of delivering these transformative results.  We know that means it will need 1 million qubits, error correction, a scalable architecture and a data center footprint.

By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today’s most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more. 

PsiQuantum is uniquely positioned to deliver on the promise of quantum computing years earlier than our competitors. Our architecture is based on photonics which gives us the ability to produce our components using existing high-volume semiconductor manufacturing processes, the same processes that are today producing billions of chips for telecom and consumer electronics applications. Since photons don’t feel heat, we can take advantage of existing cryogenic cooling systems, the kind that have been operating at facilities like the Stanford Linear Accelerator (SLAC).  And because photons are in fact light, they can move between subsystems at tremendous speed using standard fiber connectivity.

Our team is building a utility scale quantum computer and the software tools needed to build fault tolerant quantum applications. We’re a highly motivated and collaborative group focused on a singular goal - building the world’s first useful quantum computer on the fastest path possible. 

There’s much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey! 

Job Summary:

The Senior Electro-Optic Packaging Engineer  will leverage advanced numerical simulation and analysis tools to guide the design of electro-optical packages, ensuring alignment with optical, thermal, electrical, and mechanical requirements. The role involves assessing the impact of assembly processes on PIC/EIC integrity and performance, optimizing bill of materials (BOM) selection, and identifying potential risks in package designs to support risk mitigation activities. The engineer will also collaborate with experimentalists to validate and refine models, improving predictive capabilities. Expertise in thermal management and familiarity with diverse package architectures, including traditional optical, 2.5D, and 3D packaging, are essential.

This position requires an understanding of vacuum and cryogenic environmental requirements and their implications for electro-optical packaging. The engineer will provide design rules and simulation insights to drive thermal management solutions and support robust package designs.

Responsibilities:

• Utilize numerical simulation tools to interpret optical, thermal, electrical, and mechanical requirements, providing design directions for electro-optical packages.
• Assess and minimize the impact of assembly processes on PIC/EIC integrity by guiding process development through simulation insights.
• Guide BOM selection by providing simulation-driven inputs to material choices for optimal performance and reliability.
• Identify potential risks in proposed package designs or architectures and recommend mitigation strategies.
• Collaborate with experimental teams to validate and refine simulation models, enhancing their predictive accuracy.
• Develop and recommend design rules to ensure effective thermal management in package designs.
• Address and translate vacuum and cryogenic environmental requirements into electro-optical packaging solutions.
• Provide expertise in diverse package architectures, including traditional optical, 2.5D, and 3D packaging, ensuring designs meet performance, manufacturability, and reliability criteria.

Experience/Qualifications:

• Proficiency in numerical simulation tools for thermo-mechanical analysis and package design evaluation.
• Strong understanding of optical, thermal, electrical, and mechanical interactions within electro-optical packages.
• Familiarity with assembly processes such as die attach, optical coupling, underfilling, and fiber alignment, and their impact on PIC/EIC performance and reliability.
• Experience with BOM selection and optimization through simulation-driven insights.
• Knowledge of risk assessment techniques such as DFMEA and experience in driving risk mitigation plans.
• Hands-on experience with thermal management solutions and their implementation in package designs.
• Expertise in vacuum and cryogenic environments and their implications for packaging materials and architectures.
• Familiarity with traditional optical, 2.5D, and 3D package architectures, including their unique challenges and solutions.
• Familiarity with reliability requirements and testing.
• Engineering degree in Mechanical, Electrical, Materials Science, or related fields (BSc with 6+ years of experience, MSc with 3+ years, or PhD).

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.
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