Please Note:
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:
Job Description:
-
This opening is for working on chips that enable Physical Layer Products for High Speed Optical Communication.
-
architect block level design specifications from the marketing requirements and/or system requirements
-
prepare detailed design document, timing constraint file
-
RTL coding, Lint checks, CDC, Synthesis, Equivalency checking, STA, RTL/gate level simulations & silicon debug
-
Scripting for various IC design tasks such as STA, equivalency checks, test bench, simulations, synthesis, etc.
-
prepare block level resource requirements & development schedule
-
generate verification & test plans for design validation
-
Perform design tradeoff analysis – leakage, dynamic power, die size, schedule, resource, priority, etc.
-
silicon bring up and validation, ATE program bring up
Job Requirement:
-
B.S degree in EE or computer Engineering. Minimum of 12 years of work experience with direct related technical skill
-
M.S degree n EE or Computer Engineering with 10 years of work experience / Ph.D in EE or Computer Engineering with 7 years of work experience.
-
Good knowledge of ARM subsystem
-
Good knowledge of high speed digital circuit design.
-
Good knowledge of digital upsampling/downsampling
-
Good knowledge of 10G/100G/200G/400G/800G Ethernet and OTN network.
-
Good knowledge on FEC (Forward Error Correction) design.
-
Good knowledge of digital signal processing and error correction code is a plus
-
Strong analytical and problem solving skills as well as hands-on lab debugging experiences
-
Good knowledge of RTL simulation and synthesis.
-
In-depth knowledge for design for low power and design for test and design for manufacturing.
-
Good Knowledge in languages relevant to the ASIC development process including Verilog, VHDL, Unix/Perl Scripting or Python, and C.
-
Self-motivated, excellent communication skills and ability to excel in a team environment.
-
Good organization skills, able to follow through & bring issue to closure
-
Understand the entire IC development flow & procedure including silicon volume production qualification requirements & procedures
-
Enthusiastic & enjoy IC development works
-
Be able to work with teams at remote locations with different time zone.
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $141,000 - $225,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Top Skills
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs,
develops and supplies semiconductor and infrastructure software solutions.