Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.
Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!
If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.
Lightmatter is (re)inventing the future of computing with light!
About this Role
As a Package Layout Design Engineer at Lightmatter, you will design complex substrates and interposers. We hire the best of the best and provide you with the autonomy to plan and execute your designs, leveraging your industry experience to meet timelines and objectives successfully. These products will be used in one of the fastest-growing segments of the semiconductor industry and will help Lightmatter maintain its leading position in silicon photonics technology.
Responsibilities
- Deliver IC package substrate layouts for various advanced packaging technologies.
- Actively participate in the product concept phase to deliver preliminary substrate design and floorplanning to help drive overall stack up (Silicon/package/MB) optimization.
- Work with package substrate suppliers along with Outsourced Semiconductor Assembly and Test (OSAT) companies to understand layout design rules, stack up, and implementation.
- Create fab files, work with substrate suppliers, and OSATs to close design for manufacturing (DFM) / design for assembly (DFA).
- Design complex package layout keeping in mind signal integrity, power integrity, thermal and mechanical requirements.
- Design packages with analog and digital elements/interfaces.
- Support signal/power integrity engineers by providing iterative test routes to refine design rules and routing topologies.
- Project Management skills to coordinate and collaborate across multiple functional teams to ensure error free Package design Tape Out in a timely manner.
- Drive design automation & verification activities.
Qualifications
- Bachelor's degree in Electrical Engineering or similar discipline with at least 8 years of relevant experience.
- Minimum 7 years of experience in designing complex layouts.
- Experience with Cadence APD+ as the primary layout tool.
- Good understanding of the IC package substrate and organic materials, and how they will impact package design.
Preferred Qualifications
- Educational background on IC packaging and substrate layout design.
- Familiarity with system level validation tools such as Cadence Integrity 3DIC for package/IC codesign.
- Familiarity with layout tools e.g. Expedition Package Designer, Pads Layout, Altium, etc.
- Experience with various layout tool scripting languages, e.g. SKILL or Python to enable design automation.
- Demonstrated excellent communication skills and ability to collaborate effectively in cross-functional teams.
We offer competitive compensation. The base salary range for this role determined based on location, experience, educational background, and market data.
Salary Range
$175,000—$210,000 USD
- Comprehensive Health Care Plan (Medical, Dental & Vision)
- Retirement Savings Matching Program
- Life Insurance (Basic, Voluntary & AD&D)
- Generous Time Off (Vacation, Sick & Public Holidays)
- Paid Family Leave
- Short Term & Long Term Disability
- Training & Development
- Commuter Benefits
- Flexible, hybrid workplace model
- Stock Option Plan
Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.
Top Skills
What We Do
Lightmatter is a startup photonics company that has pioneered a new paradigm in processor chip architecture that uses photons instead of electrons. Now the leader in the photonic AI compute “space race,” this new class of high performance semiconductors is the foundation of Lightmatter’s mission to enable the growth of computing, reduce harmful emissions associated with this growth, and democratize computing for all.
Lightmatter's technology accelerates critical operations in deep neural networks, using an array of programmable photonic elements fabricated alongside transistors in conventional computer chip fabrication processes. Our close-knit team of engineers has created an integrated photonics chip and ultra-high performance interconnect that is faster, more efficient, and cooler than anything else on earth (or anything ever experienced before) to power the next giant leaps in human progress.
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