Manager, Sustaining Engineering, Plating and Bond & Grind

Engineering Manager, Plating and Bond & Grind

At Wolfspeed, we do amazing things in a human way.

We know that the achievements of our organization are due to the passion, hard work and creativity of our employees. We celebrate different perspectives to foster excellence across our organization, and our goal is to make diversity a foundation of what we do. We are proudly building an environment where you can bring your authentic self to work.

• Enjoy doing things that people say can’t be done? Innovation is at the center of everything we do.
• Hate red tape? We remove roadblocks instead of creating them.
• Working parent? We provide childcare assistance and paid parental leave.
• Student? We offer continuing education assistance.
• Looking for community? There are many ways to get involved, from Employee Resource Groups to local outreach.

Here’s the Gist:
This position is responsible for overseeing the Process and Equipment Engineering team supporting the electroless plating, wafer bonding, and wafer grinding modules. This person will sustain and develop processes and equipment to provide consistent device performance, yield, and quality. They will provide continuous improvement on cycle time, tool availability, and process/product yield, and will drive cost reductions in the etch module. They will also provide strategic guidance, coaching, and mentorship to their team and be highly involved in the continued staffing of the Mohawk Valley Fab.

The Day-to-Day

• Provide guidance and strategic direction to a team of 10+ engineers and technicians, while driving results in the module
• Analyze SPC/DOE data using sound statistical methodology to draw conclusions and make adjustments as needed
• Resolve process issues and continuously improve cycle time to achieve production targets
• Work cross-functionally with Operations, R&D, and New Product Introduction teams as we continue to ramp the Mohawk Valley Fab
• Own and facilitate efforts to drive best in class performance, yield, and quality; analyze and present relevant technical data to peers and senior leaders

This Job is Right for You if You Have (Minimum Requirements):

• Bachelors in Electrical Engineering, Chemical Engineering, Materials Science, or related field
• 3-5 years of experience directly managing an Engineering team in a semiconductor environment
• Experience with equipment and characterization on plating and bond/grind processes (such as electroless plating, wafer bonding and debonding, edge grinding, and wafer thinning)

This role may require additional duties and/or assignments as designated by management.

To put it legally –Wolfspeed is an equal opportunity employer.

We recruit, employ, train, compensate and promote regardless of race, sex, religion, color, national origin, disability, age, veteran status, gender identity, sexual orientation and other protected status as required by law.

The posted salary range is what Wolfspeed reasonably expects to pay for this position. Actual pay for a hired applicant will be determined based on the individual’s job-relevant qualifications, experience, and other determinative factors. In the event it is determined that a different job level upon hire is warranted then that range will be communicated to the hired applicant as soon as reasonably practicable.

$131,000.00 - $180,000.00